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Integration of electrodes in Si channels using low temperature polymethylmethacrylate bonding
V. Dukkipati and S. Pang
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 25 (2), 368-72 (2007)
 
Fully integrated optical system for lab-on-a-chip applications
Compilation and indexing terms, Copyright 2006 Elsevier Inc. All rights reserved; T3: Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
 
Anodic bonding of imperfect surfaces
Thomas Anthony
Journal of Applied Physics 54 (5), 2419-28 (1983)

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