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Vacuum measurement in wafer level encapsulations by interference microscopy
Microsystem Technologies 12 (10-11), 1063 (2006)
info:doi/10.1007/s00542-006-0160-9
Compilation and indexing terms, Copyright 2006 Elsevier Inc. All rights reserved; -11
Posted by hkt to Silicon wafers Vibration measurement deformation Microsensors encapsulation Vacuum applications on Tue Aug 07 2007 at 17:58 UTC | info | related
 
Anodic bonding of imperfect surfaces
Thomas Anthony
Journal of Applied Physics 54 (5), 2419-28 (1983)
Posted by hkt to mathematical models stresses viscous flow deformation plasticity Elasticity electric potential electrostatics glass metals bonding surfaces on Tue Aug 07 2007 at 17:51 UTC | info | related

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