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Gas pressurized hot embossing for transcription of micro-features
Microsystem Technologies 10 (1), 76 (2003)
info:doi/10.1007/s00542-003-0311-1
Compilation and indexing terms, Copyright 2006 Elsevier Inc. All rights reserved
Posted by hkt to Silicon wafers PRESSURE DISTRIBUTION Substrates Thermoplastics Microelectronic processing GASES Pressurization High temperature operations finishing on Tue Aug 07 2007 at 18:01 UTC | info | related

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