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Integration of electrodes in Si channels using low temperature polymethylmethacrylate bonding
V. Dukkipati and S. Pang
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 25 (2), 368-72 (2007)
Posted by hkt to integrated circuits integrated circuit bonding adhesive bonding channel flow Adhesives molecular biophysics elemental semiconductors Chromium Polymers Electrodes Silicon Capillarity gold glass DNA on Tue Aug 07 2007 at 18:05 UTC | info | related

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